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8Y6 – Mini-MAP
A
D2
b
(8X)
Pin 1
Index
Area
Pin 1 ID
L (8X)
D
A2
A1
e (6X)
1.50 REF.
A3
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
D
E
2.00 BSC
3.00 BSC
Notes:
1. This drawing is for general information only. Refer to JEDEC
Drawing MO-229, for proper dimensions, tolerances,
datums, etc.
2. Dimension b applies to metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip. If the
terminal has the optional radius on the other end of the
terminal, the dimension should not be measured in that
radius area.
3. Soldering the large thermal pad is optional, but not
D2
E2
A
A1
A2
A3
L
1.40
–
–
0.00
–
0.20
1.50
–
–
0.02
–
0.20 REF
0.30
1.60
1.40
0.60
0.05
0.55
0.40
recommended. No electrical connection is accomplished to
the device through this pad, so if soldered it should be tied
e
0.50 BSC
to ground
b
0.20
0.25
0.30
2
11/21/08
Package Drawing Contact:
TITLE
8Y6 , 8-lead, 2.0x3.0mm Body, 0.50mm Pitch,
GPC
DRAWING NO.
REV.
packagedrawings@atmel.com
UltraThin Mini-MAP, Dual No Lead Package
YNZ
8Y6
E
(Sawn)(UDFN)
18
Atmel AT34C02C
5185E–SEEPR–3/11
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